Halocarbon 116 Halocarbon 116 (C2F6): Used in plasma etching processes in the semiconductor industry and as a refrigerant. Purity : 99.99%. Read More »
Halocarbon 32 Halocarbon 32 (CH2F2): Commonly used as a refrigerant and as a precursor in the production of fluoropolymers. Purity:99.9% Read More »
Halocarbon 23 Halocarbon 23 (CHF3): Used as a cleaning gas in the semiconductor industry and as a refrigerant. Purity ranges typically from 99% to 99.999%. Read More »
Halocarbon 14 Halocarbon 14 (CF4): Widely used as a plasma etching gas in the semiconductor industry and as a refrigerant. Purity: 99.999%. Read More »
Germane Germane (GeH4): Used in the production of semiconductors, particularly for the deposition of germanium films. Purity: 99.999% Read More »
Disilane Disilane(SiH3)2: Primarily used in the semiconductor industry for epitaxial growth of silicon layers. Purity :99.999%. Read More »
Dichlorosilane Dichlorosilane (SiH2Cl2): Used in the production of semiconductor materials and as a precursor for silicon deposition in chemical vapor deposition (CVD) processes. Purity :2N~3N Read More »
Diborane Diborane is a chemical compound that consists of boron and hydrogen atoms and has a molecular formula B2H6. This substance is highly unstable at room Read More »
Chlorine The chemical formula of chlorine is Cl2, which is a toxic gas. It is mainly used in high-tech fields such as large-scale integrated circuits, optical Read More »